Laser welding can be successfully used to achieve wire connection with lumped
elements, block elements can be any size. Should be noted that in welding
filamentous component geometry. Different metal welding. Different types of
metal welded to solve weldability and solderability parameter range. Laser
welding between different materials, only certain combinations of materials
possible. Laser brazing. Some components of the connection should not be used
laser welding, but can use the laser as a heat source, the implementation of
soldering and brazing, laser welding also has the advantage. Brazing using a
variety of ways in which the laser is mainly used for soldering printed circuit
board soldering, especially useful in chip component assembly. Users need not to
align the emitter with the receiver of laser pointer with remote control.
Laser soldering compared with other methods has the following advantages:
because it is local heating element is not easy to produce thermal damage and
heat affected zone is small, it can be implemented in the vicinity of the
thermal component soldering. Non-contact heating, melting bandwidth, does not
require any auxiliary tool in the double-sided printed circuit board components
and equipment after the processing. Repeat stability. Flux for welding tools
pollution, and the irradiation time and easy to control the output power, laser
soldering yield. Splitting the laser beam is easy to implement, can be used
semi-lenses, mirrors, prisms, mirrors and other optical components scan time and
space partitioning, to achieve more symmetrical while welding. Multi-wavelength
laser brazing 1.06um laser as a heat source, available optical fiber
transmission, it can be difficult in the conventional way of processing parts of
welded, good flexibility. Focus is good, easy to implement automated
multi-station devices. Laser deep penetration. Metallurgical process and process
theory. Physical metallurgy of laser deep penetration electron beam welding
process is very similar, namely, the energy conversion mechanism is through the
"hole" structure to be completed. The rubber also can be the body material of
laser pointer .
At sufficiently high power density beam irradiation, the
materials have evaporated to form holes. This is full of holes like a blackbody
of steam, almost all the energy absorption of incident light, the hole cavity
equilibrium temperature of 25,000 degrees. From this high-temperature heat
transfer out of the hole wall cavity, so that the hole surrounded by metal
melting chamber.
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