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To avoid such failures, we have taken down the amount of power density design. Although the design of the power density are sometimes much lower than the COD extreme, but still occur COD failure, which is due to the laser power density is uneven, due to the local power density. Therefore, materials and devices to ensure uniformity of process, in addition, to prevent cavity surface organic contamination, because the phenomenon of re-occurrence of VOD will lead to the occurrence of COD. Laser life is a function of junction temperature, junction temperature, the lower the longer life expectancy, which is due to the possibility of the failure phenomenon and the growth rate increased with temperature, reducing the thermal resistance is to reduce the junction temperature of the most effective way. It is the sample of the green ray green laser pointer.
However, the carrier bar directly affects the quality of processing device performance is the key to semiconductor laser cooling process. Carrier must be smooth. Can only enhance the finish of the carrier to reduce the solder coating thickness, lower thermal resistance. Using high-precision grinding and polishing machines for processing of the carrier, the carrier can ensure processing quality. 3.4 semiconductor laser production process 1, substrate selection: substrate for epitaxial growth substrate, due to the quality of epitaxial growth was affected by the substrate crystal quality effect, thus requiring the provisions of the crystal substrate should have to and some deviate from the scope of a certain thickness, the appropriate doping concentration, the surface bright and smooth, no scratches, no dislocations within the basic or low error; 2, epitaxial growth: epitaxial material is metal organic chemical vapor deposition epitaxy production. Epitaxial growth process to provide better than the ion implantation impurity distribution control on the charge distribution heterostructure devices have more stringent controls. green laser pointer can be used in pitch-dark nights.
Dielectric film deposition: the deposition of dielectric film before, the wafer must be treated to remove moisture. Dielectric deposition in the P face membrane. The method used here on the sample surface sputtering deposition SiO2; 4, lithography: a lithography objective is to replicate three-dimensional graphics, the size of the graph to graph the same rigid and light. If you copy graphics consistent with the prototype, was positive copy. If the contrary, for negative replication. Graphic area and non-graphical area of difference is obtained by imaging methods. Development can not be removed or the exposure of the photoresist exposure, leaving the photoresist to form graphics, protecting the substrate from the process of chemical erosion process. 5, the corrosion SiO2: the corrosion process, etching solution temperature, concentration and the corrosion time is very critical, they will affect the corrosion effects; 6, and P-ohmic contact metal surfaces: surface ohmic contact material is TiPtAu. The wilderness explorers can use green laser pointer to guide themselves.
P epitaxial wafers before the deposition TiPtAu, acetone and other organic solvents should be repeated using a water bath cleaning. We used electron beam evaporation deposition TiPtAu, in which, for the adhesion of titanium materials; platinum as a diffusion barrier to prevent reaction of gold and titanium and gold into the GaAs; gold to provide very low resistance path that can support high-density current . In addition, thermal stress from the point of view, TiPtAu structural stability; 7, alloys: alloy ion implantation process is to activate the material, surface passivation, release the stress between the different kinds of materials. The principle is to use thermal excitation method causes the chip to control the atomic exchange. 11 8 Yanbian University undergraduate thesis, thinning, polishing: The purpose of thinning is a good electrical contact, good thermal capability. Because not only affect the conductive substrate is too thick, but also on the thermal conductivity. Thinning the substrate film can improve the thermal capacity. Stargazers can use green ray green laser pointer to point at the stars at night.
Thinning Mechanical polishing method, the method is simple, but influenced by human factors, and the thinning of the surface is rough; 9, N metal surface: electron beam evaporation deposition AuGeNi, the deposition surface pre-treatment to ensure the lake plot surface clean. 10, cleavage and measured: the semiconductor laser cavity semiconductor materials is a natural cleavage plane, so the cleavage of a direct relationship between the optical laser efficiency. Now commonly used diamond dicing dicing, the substrate film on the first diamond knife with a notch, then a precise control of pressure on the scroll bar in the substrate film, where the pressure roll bar, piece goods along the notch natural solution grounds open. The benefit of this is not a lot of pressure to make the chip cleavage. green laser pointer can be used to distinguish stars.