laser processing technology

 The laser processing system with computer numerical control technology combine to form a highly efficient automated processing equipment, has become enterprises timely production of key technologies, has opened up broad prospects for high quality, efficient and low-cost processing. The technology of laser cutting, laser welding, laser heat treatment and surface treatment technology, laser rapid prototyping technology, laser drilling, laser marking, laser etching, laser trimming, laser storage technology, has laser processing technology, including: , laser marking technology, laser cleaning technology. The more discount of  green laser pointer the manufacturer can provide, the more orders the customer will sign.
Laser cutting laser beam is focused to form a high power density of the spot irradiated workpiece materials absorb solar energy, a sharp rise in temperature, the material is quickly heated to the melting or gasification temperature, and then spray the gas blowing, in order to split the material. In this process, when the surface of the laser irradiation, part of the light workpiece absorption, another part of the optical workpiece reflection. The absorption part is converted into heat, so that the surface temperature increased rapidly, the material melting or gasification, the same time, produce a black hole effect, the material light absorption rate, rapid heating and melting or vaporization materials. Oxygen can support combustion and provide a lot of heat, so that the cutting speed. Cutting is preferable to continuous output laser. The manufacturer is able to provide more discount of green laser pointer due to the lower cost of manufacturing green laser pointer .
The electrical interconnection between the quality of which will have laminated multilayer layer have a greater impact. The pass is not correct, the reliability of the laminated multilayer printed circuit board, high density interconnect structure will bring a series of technical problems. The mutual inspection of green laser pointer achieves a pretty good result.
Therefore, it must be used to craft measures to control and resolve. Mainly uses the following process: strict control of the pressure attached to the resin coated copper foil, the dielectric layer thickness difference between 510μm. Change the laser energy density and the number of pulses (gun number), by the test methods to identify the conditions of mass production process. Bad glue residue and the clearance of the hole wall-breaking residue in bottom of the hole. These quality issues most likely to happen, which is due to the slightly improper control will have such off-the problem. Especially for handling large imposition on porous types of laminates, it is impossible to guarantee the quality problems. The self-inspection of green laser pointer is the very first step of the inspection of green laser pointer .